Free Semiconductor Manufacturing Process Seminar Webcast, Lead Free Process Overview," Thursday, July 22, 2004, 11 AM to Noon & 2 PM to 3 PM, Eastern Time.
Presented by Speedline Technologies.
(PRWEB) July 7, 2004 -- Free Technical Webcast Seminar Presented by Speedline Technologies...
Semiconductor Manufacturing Process Seminar Webcast: Lead Free Process Overview,"
Thursday, July 22, 2004,
11 AM to Noon & 2 PM to 3 PM, Eastern Time
As the semiconductor manufacturing industry continues the transition to lead-free manufacturing, there are still many questions to consider before implementation on your manufacturing floor.
What equipment and process changes are required?
What detailed issues must the process engineer consider to optimize the lead free process?
This seminar, presented by Speedline Technologies (www.speedlinetech.com) will provide an overview of the lead-free transition.
Topics will include:
- Definition of a lead free process
- Regulatory update
- Available lead free alloys and their advantages and disadvantages
- Process considerations for lead-free manufacturing equipment:
- Solder Paste Printing
- Reflow Soldering
- Wave Soldering
- Inspection and Test
- Printed Circuit Board Design Considerations
- Process impact on quality (first pass yield and cycle time)
- Failure modes
The seminar is free. To register, or for more information, visit www.speedlinetech.com/seminars on the Web or call 508-541-4749.
Participation is as easy as visiting a website and dialing into a toll-free telephone number.
Future seminar topics and dates include:
- Thurs., Aug. 19: Lead-Free Reflow Soldering
- Thurs., Sept. 23: Lead-Free Wave Soldering
- Thurs., Oct. 21: Improving Final Product Quality
- Thurs., Nov. 18: Reliable Underfill Dispensing
- Thurs., Dec. 16: The Fine Pitch Printing Process
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