Comlent, a leading fabless RFIC design house headquartered in China starts sampling Chinas first RFIC PA for wireless terminals. This BiCMOS process-based PA operates at 1.9GHz and targets both the European digital cordless phone market which uses the Digital Enhanced Cordless Telephony (DECT) standard and PAS/PHS handset market. Samples of the PA for the DECT phone have been available since late last year, and the qualification and certification process for the DECT handset design will be carried out in the near future.
SHANGHAI, China, January 17, 2005 -- Comlent, a fabless radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang Hi-tech Park, announced today that it has started sampling Chinas first RFIC PA for wireless terminals. This BiCMOS process-based PA operates at 1.9GHz and targets both the European digital cordless phone market which uses the Digital Enhanced Cordless Telephony (DECT) standard and PAS/PHS handset market. Samples of the PA for the DECT phone have been available since late last year, and the qualification and certification process for the DECT handset design will be carried out in the near future.
This production-ready PA is based on Jazz Semiconductors leading BiCMOS process technology. It has a 3-stage design that offers up to 30dB gain and 24-dBm of output power. A specially designed QFN-16 package is used to provide good electrical performance and heat conduction.
The DECT digital cordless phone market in Europe has experienced strong growth in recent years, with approximately 30 million units shipped in 2003. In addition, the existing Northern American digital cordless phone market that uses 2.4GHz DSS technology is expected to gradually adopt the DECT standard in the future, a trend that could provide further growth potential for PA products such as those provided by Comlent.
Comlents investors include leading venture capital institutional investors such as Intel Capital, 3i and Draper Fisher Jurvetson, Shanghai municipal and Zhangjiang Hi-tech Park venture funds as well as top executives from several leading semiconductor companies in the US, Taiwan and Europe.
In the past two and a half years, Comlent has invested millions of US dollars in R&D to develop proprietary and patented IP for RFIC transceiver and PA designs in both CMOS and BiCMOS technologies. After Comlents recent success in sampling Chinas first whole RFIC transceiver, this new addition of RFIC PA product evidences Comlents continual leadership in China", says co-founder and CEO of Comlent, Dr. Kai Chen. Comlent will relentlessly strengthen and execute our business vision and mission to provide the world class RFIC technology to our local customers, together with our strong support and quality service, in order to enable them to win in the domestic and global marketplaces."
Jazz Semiconductor is pleased to learn Comlents latest progress in addressing China, the worlds largest wireless terminal market. Our partnership with Chinas emerging fabless RFIC design houses is important to our China strategy", stated Paul Kempf, chief technology and marketing officer at Jazz Semiconductor. Comlents continuous progress further reinforces our confidence and commitment to these emerging markets".
About Comlent:
Established in 2002, Comlent, a fabless radio frequency integrated circuit (RFIC) design house headquartered in Zhangjiang Hi-tech Park, Shanghai, China, is a leading RFIC provider that focuses on the exploding wireless communication market of China. Initial products of Comlent include RFIC transceivers in both CMOS and BiCMOS technologies for mobile handsets in 1.9GHz-2.4GHz frequency range. Comlent provides enabling RFIC technology, strong support and quality service to serve Chinas mobile communication market that has 300+ million mobile phone and 70 million PHS/PAS subscribers, 400 million domestic TV sets and manufacturers of 70 million cordless phone units per year. For more information, please visit www.Comlent.com.
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