SSC, Inc. Engineering Services have introduced a Reduced Foot Print (RFP) Process Module featuring a redesign of the standard Novellus Shrink modules. The enhanced Novellus Shrink modules save more that two square feet and include further modifications such as improved maintenance access and added connection schemes.
(PRWEB) May 11, 2005 -- SSC, Inc. Engineering Services have taken a Standard size Novellus C2 module and repackaged the components into a smaller size. The RFP now occupies less floor space than equivalent Novellus Shrink modules by more than two square feet.
The RFP is the result of customer demand for smaller foot print Novellus C2 process modules and a shortage of Novellus Shrink modules in the used marketplace," said Tom Irby, Director of Sales and Marketing at SSC, Inc.
The RFP is a tool repackaging service of the Novellus Standard C2, with noteworthy innovative design enhancements. SSC, Inc. redesigned the gas box utilizing C" seal surface mount technology, digital MFCs and the latest pneumatic control system while maintaining OEM process exact specifications.
As compared with standard Novellus Shrink modules, other enhancements include:
• improved flexibility of the gas box configuration
• repositioned components with improved maintenance access
• choices of three different facility connection schemes (out the back, through the floor and out the side)
• improved monitoring visibility of the heater and pressure control systems
The RFP will be available for the Altus and Sequel systems, and delivery is scheduled for late Q1 2005. For additional information on this Novellus Shrink modules alternative, visit www.RFP1.com
About SSC, Inc. Engineering Services
Since 1996, SSC, Inc. has specialized in capital equipment remanufacturing, reconfiguration, and upgrades for Novellus and Applied Materials Legacy Products.
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