September 05, 2008
Home
About
Submit Press Release
PR Firms
Editors/Journalists
Search Archives
 
News Releases by Category  
News by Country  
News by MSA  
All News for Today  
Browse News by Day  
News by Trackbacks  
All Press Releases for September 12, 2007 Subscribe to this News Feed  
 

Rohm and Haas Delivers Ultra-Low Defectivity CMP Pad for Advanced Copper Barrier Processes: VisionPad(TM) Product Line Adopts Application Specific Approach

Download this press release as an Adobe PDF document.

Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization technology for the global semiconductor industry, today formally introduced the EcoVision(TM) 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond. The EcoVision 4000 pad is the latest addition to Rohm and Haas' VisionPad product line, which offers highly specialized CMP solutions for advanced semiconductor manufacturing processes.

PHOENIX & HSINCHU, Taiwan (BusinessWire EON) September 12, 2007 -- Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization technology for the global semiconductor industry, today formally introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond. The EcoVision 4000 pad is the latest addition to Rohm and Haas VisionPad product line, which offers highly specialized CMP solutions for advanced semiconductor manufacturing processes.

The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements.
As customers switch to advanced processes and nodes, we offer products designed for their specific polishing needs, explained Cathie Markham, vice president of technology for Rohm and Haas Electronic Materials, CMP Technologies. The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements.

The EcoVision 4000 CMP pad features a unique design and chemistry allowing customers to achieve a significant reduction in cost of ownership with highly consistent performance over the products lifetime. The lifetime of the EcoVision 4000 pad demonstrates a significant improvement over existing soft pads for copper barrier applications and is comparable to hard pads such as the industry-standard IC1000 pad, used for bulk copper removal CMP applications. This allows users to change the pads on all platens at the same time, minimizing the costs associated with downtime and qualification processes.

The pads innovative manufacturing process produces a surface that results in increased contact area between the pad and the wafer. This reduces defects and improves die yields by minimizing scratches and chatter marks across the wafer resulting in bestof-class defectivity performance. Unlike soft pads, the EcoVision 4000 pad is conditioned, allowing for pad surface regeneration to achieve optimal polishing results that are consistent throughout the pads life as well as from pad to pad.

The EcoVision 4000 pad is currently available for customer sampling in multiple product configurations, and will be available commercially in Q4 of this year. The product will be featured at SEMICON Taiwan from September 12-14 in Hall 1 Booth 1252.

About Rohm and Haas Electronic Materials

Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, advanced packaging, and flat panel display industries, its products and technologies are integral elements in electronic devices around the world.

The CMP Technologies business has been a leader and innovator in polishing technology for the global semiconductor industry since 1969. CMP Technologies products include polishing pads, conditioners and slurries. CMP Technologies maintains operations throughout the world, including manufacturing facilities in Newark, Delaware, Hsinchu, Taiwan and in the Mie and Kyoto prefectures in Japan. Additional information is available at http://www.rohmhaas.com.

About Rohm and Haas Company

Leading the way since 1909, Rohm and Haas (NYSE:ROH) is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The companys technologies are found in a wide range of markets including: Building and Construction, Electronics, Food and Retail, Household and Personal Care, Industrial Process, Packaging, Paper, Transportation and Water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.2 billion in 2006. Visit www.rohmhaas.com for more information. Imagine the possibilities.

Trackback URL: http://www.prweb.com/pingpr.php/RW1wdC1GYWx1LUVtcHQtTWFnbi1UaGlyLVplcm8=


See the original story at: http://eon.businesswire.com/releases/ecovision/technologies/prweb553168.htm
Email this story to a colleague
Printer Friendly Version
Bookmark with del.icio.us
Bookmark with Y!MyWeb
Submit to Digg
Amy Smith
Impress Public Relations
401-369-9266
Email us Here

There are no multimedia files attached to this release. If this is your release you may add images or other multimedia files through your login.

If you have any questions regarding information in these press releases please contact the company listed in the press release. Please do not contact PRWeb. We will be unable to assist you with your inquiry. PRWeb disclaims any content contained in these release. Our complete disclaimer appears here.
 
Disclaimer: If you have any questions regarding information in these press releases please contact the company listed in the press release.
Please do not contact PRWeb®. We will be unable to assist you with your inquiry.
PRWeb® disclaims any content contained in these releases. Our complete disclaimer appears here.

© Copyright 1997-2007, Vocus PRW Holdings, LLC.
Vocus, PRWeb and Publicity Wire are trademarks or registered trademarks of Vocus, Inc. or Vocus PRW Holdings, LLC.

Terms of Service | Privacy Policy | Copyright